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Product Description
The SiRFstarIII chip is distinguished from earlier SiRF chips and from GPS chipsets made by other manufacturers (Garmin or Trimble Inc for example), largely due to its ability to acquire and maintain a signal lock in urban or densely covered forest environments, and its faster Time to First Fix (TTFF), the time it takes for a GPS receiver to lock onto the satellite signals and determine the initial position.
Features:
■ SiRF Star III chipset
■ Low Power: Under 60mW at full power / 46mW tracking power
■ 3.0V to 3.6V operation
■ High sensitivity for indoor fixes
■ Support 20-channel GPS
■ Real-time navigation for location-based services
■ Multi-standard support: 3GPP,3GPP2,PDC,iDEN and TIA-916
■ Multi-mode: Mobile centric to network cenPtric
■ Interface: 2 UARTs& 1 GPIO
■ RoHS Compliant
■ On Board Capacitor (0.08F) for RTC, Over 30 minutes back-up power
■ Dimensions - 29 X 26 X 8.4 mm (With Patch Antenna)
Features:
■ SiRF Star III chipset
■ Low Power: Under 60mW at full power / 46mW tracking power
■ 3.0V to 3.6V operation
■ High sensitivity for indoor fixes
■ Support 20-channel GPS
■ Real-time navigation for location-based services
■ Multi-standard support: 3GPP,3GPP2,PDC,iDEN and TIA-916
■ Multi-mode: Mobile centric to network cenPtric
■ Interface: 2 UARTs& 1 GPIO
■ RoHS Compliant
■ On Board Capacitor (0.08F) for RTC, Over 30 minutes back-up power
■ Dimensions - 29 X 26 X 8.4 mm (With Patch Antenna)
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